Seth Price

PO Box 3365

Socorro, NM 87801

(505)-418-8891

n3mra@yahoo.com

Objective: To use my knowledge in engineering and meteorology in education.

Education:

B.S. Materials Science and Engineering, May 2005. Virginia Polytechnic Institute and State University (Virginia Tech). In-major GPA: 3.12/4.0.

M.S. Materials and Metallurgical Engineering, expected May 2007. New Mexico Institute of Mining and Technology (New Mexico Tech).

Relevant Work Experience:

Virginia Tech—Storm Chase Technical Advisor

June 2003, May 2004, May 2005, Every spring

· Managed and repaired equipment on storm chase field studies for CEE 2984: Applied Meteorology. Added equipment for emergency communication and position tracking.

New Mexico Tech—Ceramics Laboratory

August 2005—Present

· To be determined.

Virginia Tech—Physical Metallurgy Laboratory

January 2005—May 2005

· Metallography, SEM, and sample preparation of steel, iron, brass and aluminum samples. Hardness tests and heat-treatment of aluminum.

Virginia Tech—Aerospace Materials Grader

January 2005—May 2005

· Graded quizzes, homework and tests for ~25 students

Virginia Tech—Physical Ceramics Laboratory

August 2004—December 2004

· Manufacture and characterization of high-tension electrical porcelains. Involved glass manufacturing, furnace operation, X-Ray diffraction, dilatometry and microscopy.

Awards and Publications:

• “Biological Self-Assembled Porous Ceramics as High Temperature Insulation in Steam Transport Pipes”, Journal of Undergraduate Materials Research, August 2005.
• “The Amateur Storm Chaser”, QST, March 2004.
• “The Role of Amateur Radio in Storm Chasing”, World Radio, Accepted July 2005.
• Dean’s List, Spring 2004, Spring 2005.
• Nanticoke Amateur Radio Club Scholarship, 2004.
• American Foundrymen Society Scholarship, 2005.
• Ten-Ten International Net Scholarship, 2005.

Professional Societies:

• National Weather Association (NWA)
• Materials Advantage Student Member (TMS/ASM and ACerS)
• American Foundrymen Society Member (AFS)
• International Microelectronic and Packaging Society (IMAPS)

References available upon request.