ELECTRONICS: ELECTRONICS PACKAGING
PACKAGE TYPES
There are many, many designs and methods for electronics packaging. This is just a basic overview of types of packages. Through Hole Packages mean the pins for the package pass through the board they are mounted to and soldered from the underside. Surface Mount Packages are just placed on pads and soldered from above (pins do not extend through board).
THROUGH HOLE PACKAGE
| PICTURE |
ACRONYM |
TYPE |
|
DIP |
Dual In-line Package |
|
SH-DIP |
Shrink Dual In-line Package |
|
SK-DIP, SL-DIP |
Skinny Dual In-line Package, Slim Dual In-line Package |
|
SIP |
Single In-line Package |
|
ZIP |
Zig-Zag In-line Package |
|
PGA |
Pin Grid Array |
SURFACE MOUNT PACKAGE
| PICTURE |
ACRONYM |
TYPE |
|
SO or SOP |
Small Out-Package |
|
CFP |
Quad Flat Package |
|
LCC |
Leadless Chip Carrier |
|
PLCC, SOJ |
Plastic Leader Chip Carrier with Butt Leads |
|
BGA |
Ball Grid Array |
|
TAB |
Tape Automated Bonding |
|
CSP |
Chip Scale Package |